The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Sep. 12, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles L. Arvin, Savannah, GA (US);

Brian M. Erwin, Lagrangeville, NY (US);

Eric D. Perfecto, Poughkeepsie, NY (US);

Wolfgang Sauter, Eagle-Vail, CO (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/0544 (2013.01);
Abstract

A method including forming a copper pillar, electroplating a metal layer on a top surface and a sidewall of the copper pillar, and electroplating a metal cap above the top surface of the copper pillar in direct contact with the metal layer. The method further including forming an intermetallic by heating the metal layer and the copper pillar in a non-reducing environment, the intermetallic including elements of both the copper pillar and the metal layer, where molten solder will wet to the metal cap and will not wet to the intermetallic.


Find Patent Forward Citations

Loading…