The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Oct. 28, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Charles L. Arvin, Savannah, GA (US);
Harry D. Cox, Rifton, NY (US);
Brian M. Erwin, Lagrangeville, NY (US);
Jorge A. Lubguban, Ridgefield, CT (US);
Eric D. Perfecto, Poughkeepsie, NY (US);
Jennifer D. Schuler, Poughquag, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); H01L 21/683 (2006.01); B32B 9/04 (2006.01); B32B 17/06 (2006.01); B32B 7/12 (2006.01); B32B 7/06 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 9/04 (2013.01); B32B 17/06 (2013.01); B32B 2457/14 (2013.01); H01L 22/12 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A method for processing a semiconductor wafer where an opaque layer is located on a surface of a handling wafer is used so the surface of the handling wafer may be detected through optical sensors. The opaque layer may be modified, or oriented, to allow light to pass through unobstructed.