The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Oct. 26, 2004
Benjamin V. Fasano, New Windsor, NY (US);
Richard F. Indyk, Wappingers Falls, NY (US);
Kevin M. Prettyman, Poughkeepsie, NY (US);
Benjamin V. Fasano, New Windsor, NY (US);
Richard F. Indyk, Wappingers Falls, NY (US);
Kevin M. Prettyman, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention provides a method for producing a temporary chip carrier for semiconductor chip burn-in test and speed sorting. A multi-layered substrate or card, usually comprised of one of various materials is made by offsetting the conductor-filled vias or holes in the outer few layers with the outer most layer not being filled with a conductor, such that a partially filled via or hole is produced. This effectively produces a smaller surface conductor feature, on which the semiconductor chip is temporarily attached, electrically tested, and subsequently removed using various methods, at forces much lower than normal chip removal processes require.