Wappingers Falls, NY, United States of America

Sudipta Kumar Ray

This inventor holds 51 USPTO granted patents, primarily in Multichip Module Packaging (CPC class H01L). Top assignees: International Business Machines Corporation, Jds Uniphase Corporation. Active years: 1984-2016.

USPTO Granted Patents = 51

% Patents Active = 72.5

Average Co-Inventor Count = 4.8

ph-index = 20

Forward Citations = 1,405(Granted Patents)

Forward Citations (Not Self Cited) = 1,382(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Wappingers Falls, NY (US) (1984 - 2012)
Research Triangle Park, NC (US) (2012)
Hopewell Junction, NY (US) (2013)
Armonk, NY (US) (2013)
Wappingers Fall, NY (US) (2016)

Company Filing History:

50 out of 166,159

International Business Machines Corporation

patents

1 out of 851

Jds Uniphase Corporation

patents

Years Active: 1984-2016

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Areas of Expertise:

Multichip Modules

Printed Circuit Boards

Optoelectronic Packaging

Solder Structures

Chip Interconnection

High Density Connections

Ball Grid Arrays

Dielectric Interposer

Electrical Interconnection

Column Grid Array

Fatigue Life Enhancement

Secure Encryption Applications

51 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9433105 - Method of fabricating printed circuit boards (2016-08-30),

2. 8466543 - Three dimensional stacked package structure (2013-06-18),

3. 8450849 - Robust FBEOL and UBM structure of C4 interconnects (2013-05-28),

4. 8304290 - Overcoming laminate warpage and misalignment in flip-chip packages (2012-11-06),

5. 8227918 - Robust FBEOL and UBM structure of C4 interconnects (2012-07-24),

6. 7806341 - Structure for implementing secure multichip modules for encryption applications (2010-10-05),

7. 7472836 - Method and structure for implementing secure multichip modules for encryption applications (2009-01-06),

8. 7281667 - Method and structure for implementing secure multichip modules for encryption applications (2007-10-16),

9. 6984792 - Dielectric interposer for chip to substrate soldering (2006-01-10),

10. 6908025 - Preparing MCM hat for removal (2005-06-21),

11. 6878608 - Method of manufacture of silicon based package (2005-04-12),

12. 6827505 - Optoelectronic package structure and process for planar passive optical and optoelectronic devices (2004-12-07),

13. 6784086 - Lead-free solder structure and method for high fatigue life (2004-08-31),

14. 6762119 - Method of preventing solder wetting in an optical device using diffusion of Cr (2004-07-13),

15. 6713686 - Apparatus and method for repairing electronic packages (2004-03-30),

Title: Inventor Sudipta Kumar Ray: Pioneering Innovations in Wappingers Falls

Introduction: Sudipta Kumar Ray is a visionary inventor based in Wappingers Falls, NY, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Sudipta Kumar Ray holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her commitment to creating a more sustainable future.

Career Highlights: With a background in engineering and a passion for problem-solving, Sudipta Kumar Ray has led numerous successful projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout her career, Sudipta Kumar Ray has collaborated with leading research institutions, universities, and tech companies to bring her ideas to life and make a lasting impact on society.

Conclusion: Sudipta Kumar Ray's dedication to innovation and her relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.