The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Dec. 18, 2009
Richard S. Graf, Research Triangle Park, NC (US);
Thomas E. Lombardi, Research Triangle Park, NC (US);
Sudipta K. Ray, Research Triangle Park, NC (US);
David J. West, Research Triangle Park, NC (US);
Richard S. Graf, Research Triangle Park, NC (US);
Thomas E. Lombardi, Research Triangle Park, NC (US);
Sudipta K. Ray, Research Triangle Park, NC (US);
David J. West, Research Triangle Park, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus, system, and method are disclosed for connecting an integrated circuit device to a substrate. A plurality of standard diameter pillars and three or more increased diameter pillars are disposed on an integrated circuit device. The increased diameter pillars have a diameter that is greater than the standard diameter pillars and a height that is similar to the standard diameter pillars. The standard diameter pillars and the increased diameter pillars form a pattern on the integrated circuit device that corresponds to contact pads on a substrate opposite the integrated circuit device. A first group of solder bumps is disposed between the standard diameter pillars and the contact pads. A second group of solder bumps is disposed between the increased diameter pillars and the contact pads. The second group of solder bumps has pre-connection heights that are greater than pre-connection heights of the first group of solder bumps.