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Gray, ME, United States of America

Richard Stephen Graf

USPTO Granted Patents = 50 (Patent Applications = 10)

Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 69(Granted Patents)

Forward Citations (Not Self Cited) = 55(Dec 10, 2025)

Location History:

Research Triangle Park, NC (US) (2012)
Falmouth, ME (US) (2017)
Gray, ME (US) (2013 - 2023)

Company Filing History:

29 out of 164,197

International Business Machines Corporation

14 out of 5,671

Globalfoundries Inc.

Marvell Asia Pte., Ltd.

Elpis Technologies Inc.

5. 1 out of 941

Globalfoundries U.S. Inc.

Years Active: 2012-2025

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Areas of Expertise:

Integrated Circuit Packaging

Thermal Management

Chip-on-Chip Structure

Wafer Level Packaging

Thermoelectric Cooling

Three-Dimensional Packaging

Photonic Bond Pads

Embedded Peltier Devices

Silicon Interposers

Millimeter Wave Packaging

Thermal Via Structures

Printed Circuit Board Fabrication

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12199003 - Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure (2025-01-14),

2. 11810832 - Heat sink configuration for multi-chip module (2023-11-07),

3. 11682646 - IC chip package with dummy solder structure under corner, and related method (2023-06-20),

4. 11366154 - Enabling of functional logic in IC using thermal sequence enabling test (2022-06-21),

5. 11171104 - IC chip package with dummy solder structure under corner, and related method (2021-11-09),

6. 10978416 - Dual bond pad structure for photonics (2021-04-13),

7. 10833038 - Dual bond pad structure for photonics (2020-11-10),

8. 10734346 - Method of manufacturing chip-on-chip structure comprising sinterted pillars (2020-08-04),

9. 10651135 - Tamper detection for a chip package (2020-05-12),

10. 10476227 - Dual bond pad structure for photonics (2019-11-12),

11. 10340241 - Chip-on-chip structure and methods of manufacture (2019-07-02),

12. 10304763 - Producing wafer level packaging using leadframe strip and related device (2019-05-28),

13. 10249590 - Stacked dies using one or more interposers (2019-04-02),

14. 10170224 - Low temperature fabrication of lateral thin film varistor (2019-01-01),

15. 10083891 - Memory having thermoelectric heat pump and related IC chip package and method (2018-09-25),

Title: The Innovative Journey of Richard Stephen Graf

Introduction:

Richard Stephen Graf, a distinguished inventor hailing from Gray, ME (US), has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Richard Stephen Graf's latest patents include a cutting-edge software application for data encryption, a revolutionary medical device for remote patient monitoring, and a sustainable energy solution for residential use.

Career Highlights:

Throughout his illustrious career, Richard Stephen Graf has been recognized for his inventive prowess, receiving multiple awards for his groundbreaking technologies. His work has not only transformed industries but has also improved the lives of many around the world.

Collaborations:

Richard Stephen Graf has collaborated with leading research institutions, top universities, and innovative companies to further develop and commercialize his inventions. His collaborative spirit has led to the successful implementation of cutting-edge technologies in various sectors.

Conclusion:

In conclusion, Richard Stephen Graf's passion for innovation and his dedication to creating impactful solutions have solidified his position as a trailblazer in the world of technology. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators.

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