The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Nov. 02, 2021
Applicant:
Marvell Asia Pte, Ltd., Singapore, SG;
Inventors:
Manish Nayini, Wappingers Falls, NY (US);
Richard S. Graf, Gray, ME (US);
Janak G. Patel, South Burlingtron, VT (US);
Nazmul Habib, Colchester, VT (US);
Assignee:
MARVELL ASIA PTE LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); B23K 1/00 (2006.01); H01L 23/31 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); B23K 1/0008 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/3157 (2013.01); H01L 23/49805 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); B23K 2101/40 (2018.08); H01L 2224/13211 (2013.01); H01L 2224/13239 (2013.01); H01L 2224/13247 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14517 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81125 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/35121 (2013.01);
Abstract
An integrated circuit (IC) chip package includes a substrate and a wafer comprising an IC chip arranged on the substrate. The substrate includes first mounting pads unconnected to electrical connections in the substrate. The wafer includes second mounting pads that are disposed around corners of the IC chip, that extend radially outward relative to circuitry in the IC chip, that are unconnected to circuitry in the IC chip, and that mate with the first mounting pads on the substrate, respectively.