The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Nov. 02, 2021
Marvell Asia Pte, Ltd., Singapore, SG;
Manish Nayini, Wappingers Falls, NY (US);
Richard S. Graf, Gray, ME (US);
Janak G. Patel, South Burlingtron, VT (US);
Nazmul Habib, Colchester, VT (US);
MARVELL ASIA PTE LTD., Singapore, SG;
Abstract
An integrated circuit (IC) chip package includes a substrate and a wafer comprising an IC chip arranged on the substrate. The substrate includes first mounting pads unconnected to electrical connections in the substrate. The wafer includes second mounting pads that are disposed around corners of the IC chip, that extend radially outward relative to circuitry in the IC chip, that are unconnected to circuitry in the IC chip, and that mate with the first mounting pads on the substrate, respectively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile