For the Inventor, By the Inventor

Enter inventor name

South Burlington, VT, United States of America

Nazmul Habib

USPTO Granted Patents = 57 (Patent Applications = 5)

Average Co-Inventor Count = 4.0

ph-index = 8

Forward Citations = 191(Granted Patents)

Forward Citations (Not Self Cited) = 168(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Essex Junction, VT (US) (2012 - 2019)
South Burlington, VT (US) (2008 - 2021)
Colchester, VT (US) (2015 - 2023)

Company Filing History:

47 out of 164,197

International Business Machines Corporation

Globalfoundries Inc.

Marvell Asia Pte., Ltd.

4. 2 out of 672

Mentor Graphics Corporation

Years Active: 2008-2023

Loading Chart...

Areas of Expertise:

Integrated Circuit Reliability

Semiconductor Manufacturing Defects

Power Performance Optimization

Physically Unclonable Function

Temperature Profiling

Strain Normalization

Voltage Binning

Chip Identification

Heat Sink Configuration

Product Performance Binning

Current Pulse Damage Prevention

Multicore Processor Optimization

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11810832 - Heat sink configuration for multi-chip module (2023-11-07),

2. 11682646 - IC chip package with dummy solder structure under corner, and related method (2023-06-20),

3. 11171104 - IC chip package with dummy solder structure under corner, and related method (2021-11-09),

4. 11054459 - Optimization of integrated circuit reliability (2021-07-06),

5. 10996259 - Optimization of integrated circuit reliability (2021-05-04),

6. 10989754 - Optimization of integrated circuit reliability (2021-04-27),

7. 10794952 - Product performance test binning (2020-10-06),

8. 10700013 - IC wafer for identification of circuit dies after dicing (2020-06-30),

9. 10564214 - Optimization of integrated circuit reliability (2020-02-18),

10. 10539611 - Integrated circuit chip reliability qualification using a sample-specific expected fail rate (2020-01-21),

11. 10216870 - Methodology to prevent metal lines from current pulse damage (2019-02-26),

12. 10168685 - Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies (2019-01-01),

13. 10162325 - Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies (2018-12-25),

14. 10089161 - System and method for managing semiconductor manufacturing defects (2018-10-02),

15. 10067184 - Product performance test binning (2018-09-04),

Title: The Innovative Journey of Nazmul Habib

Introduction: Nazmul Habib, a talented inventor hailing from South Burlington, VT (US), has made significant contributions to the field of technology through his groundbreaking inventions.

Latest Patents: Nazmul Habib's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a novel wearable device for monitoring and improving overall health and fitness.

Career Highlights: With a background in electrical engineering, Nazmul Habib has spent over two decades pushing the boundaries of innovation. He has worked for renowned tech companies, leading research institutions, and universities, honing his skills and expertise along the way.

Collaborations: Throughout his career, Nazmul Habib has collaborated with top-notch engineers, designers, and scientists to bring his ideas to life. His ability to work in multidisciplinary teams has led to the successful development of several groundbreaking products.

Conclusion: Nazmul Habib's passion for innovation, coupled with his technical acumen, has solidified his position as a trailblazer in the world of technology. His relentless pursuit of excellence continues to inspire the next generation of inventors and engineers.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…