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For the Inventor, By the Inventor

South Burlington, VT, United States of America

Nazmul Habib

This inventor holds 57 USPTO granted patents and 5 published patent applications, primarily in Integrated Circuit Reliability (CPC class H01L). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Marvell Asia Pte., Ltd.. Active years: 2008-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nazmul Habib. Retrieved from https://idiyas.com/inventor/nazmul-habib

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 57 

% Patents Active = 33.3

Average Co-Inventor Count = 4.0

ph-index = 8

Forward Citations = 192(Granted Patents)

Forward Citations (Not Self Cited) = 168(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Essex Junction, VT (US) (2012 - 2019)
  • South Burlington, VT (US) (2008 - 2021)
  • Colchester, VT (US) (2015 - 2023)

Company Filing History:

goldMedal47 out of 166,325 
 
International Business Machines Corporation
 patents
silverMedal5 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal3 out of 1,233 
 
Marvell Asia Pte., Ltd.
 patents
4. 2 out of 672 
 
Mentor Graphics Corporation
 patents

Years Active: 2008-2023

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Areas of Expertise:
Integrated Circuit
Reliability
Semiconductor Manufacturing
Performance Optimization
Heat Sink Configuration
Chip Package
Failure Mechanism
Voltage Binning
Power Control
Strain Normalization
Device Reliability
Failure Avoidance
57 patents (USPTO):Explore Patents
1. 11810832 - Heat sink configuration for multi-chip module (2023-11-07),
2. 11682646 - IC chip package with dummy solder structure under corner, and related method (2023-06-20),
3. 11171104 - IC chip package with dummy solder structure under corner, and related method (2021-11-09),
4. 11054459 - Optimization of integrated circuit reliability (2021-07-06),
5. 10996259 - Optimization of integrated circuit reliability (2021-05-04),
6. 10989754 - Optimization of integrated circuit reliability (2021-04-27),
7. 10794952 - Product performance test binning (2020-10-06),
8. 10700013 - IC wafer for identification of circuit dies after dicing (2020-06-30),
9. 10564214 - Optimization of integrated circuit reliability (2020-02-18),
10. 10539611 - Integrated circuit chip reliability qualification using a sample-specific expected fail rate (2020-01-21),
11. 10216870 - Methodology to prevent metal lines from current pulse damage (2019-02-26),
12. 10168685 - Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies (2019-01-01),
13. 10162325 - Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies (2018-12-25),
14. 10089161 - System and method for managing semiconductor manufacturing defects (2018-10-02),
15. 10067184 - Product performance test binning (2018-09-04),

Title: The Innovative Journey of Nazmul Habib

Introduction: Nazmul Habib, a talented inventor hailing from South Burlington, VT (US), has made significant contributions to the field of technology through his groundbreaking inventions.

Latest Patents: Nazmul Habib's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a novel wearable device for monitoring and improving overall health and fitness.

Career Highlights: With a background in electrical engineering, Nazmul Habib has spent over two decades pushing the boundaries of innovation. He has worked for renowned tech companies, leading research institutions, and universities, honing his skills and expertise along the way.

Collaborations: Throughout his career, Nazmul Habib has collaborated with top-notch engineers, designers, and scientists to bring his ideas to life. His ability to work in multidisciplinary teams has led to the successful development of several groundbreaking products.

Conclusion: Nazmul Habib's passion for innovation, coupled with his technical acumen, has solidified his position as a trailblazer in the world of technology. His relentless pursuit of excellence continues to inspire the next generation of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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