Methods for assembling stacked substrate packages including dies, laminated base substrates, and dielectric build-up substrates

Abstract

A method for assembling a stacked substrate package includes: a) binding a laminated base substrate, configured to route interconnections between first and second surfaces of the laminated base substrate, to a rigid carrier to prevent warping of the laminated base substrate; b) coupling an integrated circuit die to a dielectric build-up substrate to form a substrate stack, where the dielectric build-up substrate routes interconnections between first and second surfaces of the dielectric build-up substrate; c) coupling the second surface of the dielectric build-up substrate to the laminated base substrate; and d) releasing the rigid carrier from the laminated base substrate. At least one of: a) is performed before b) and c), b) and c) are performed at the same time, and d) is performed after a), b) and c); or b) is performed before c), c) is performed after a), and d) is performed after a), b) and c).