Luke England

Title: Innovations by Luke England

Introduction

Luke England is an accomplished inventor based in Lakeway, Texas. He has made significant contributions to the field of electronics, particularly in packaging technologies for integrated circuits. His innovative approach has led to the development of a unique patent that enhances the efficiency and functionality of electronic devices.

Latest Patents

Luke England holds a patent for "Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure." This invention involves an electronic device packaged with an interposer, fan-out interconnect (FOI), and a lid. The interposer features a first surface with die terminals (DTs) that electrically couple to integrated circuit die (IC), and a second surface with substrate terminals (STs) that connect to the substrate. The IC is smaller than the interposer, allowing for efficient mounting and electrical contact. The FOI facilitates electrical interconnection between DTs and STs, with varying pitch sizes to optimize performance.

Career Highlights

Luke England is currently employed at Marvell Asia Pte., Ltd., where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in modern electronic devices. With a focus on improving the integration and performance of electronic components, he has established himself as a key player in his field.

Collaborations

Luke collaborates with talented professionals such as Richard Stephen Graf and Huahung Kao. Their combined expertise contributes to the success of their projects and the advancement of technology at Marvell Asia Pte., Ltd.

Conclusion

Luke England's contributions to electronic packaging technology demonstrate his innovative spirit and commitment to advancing the field. His patent reflects a significant step forward in the design and functionality of electronic devices.