The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Aug. 12, 2021
Marvell Asia Pte Ltd, Singapore, SG;
Luke England, Lakeway, TX (US);
Richard Stephen Graf, Gray, ME (US);
Huahung Kao, San Jose, CA (US);
Ronen Sinai, Yokneam Illit, IL;
Marvell Asia PTE Ltd., Singapore, SG;
Abstract
An electronic device disposed in a package that includes: an interposer, fan-out interconnect (FOI), and a lid. The interposer having first size and first surface upon which die terminals (DTs) are disposed and are configured to electrically couple to integrated circuit die (IC), and second surface upon which substrate terminals (STs) are disposed and are configured to electrically couple to substrate. The IC has second size smaller than the first size, and the IC is mounted on the first surface in electrical contact with the DTs, the interposer is mounted on third surface, and the package substrate has third size, larger than the first size. The FOI establishes electrical interconnection between DTs and STs, the DTs have first pitch size and the STs have second pitch size, larger than first pitch size. The lid has first section, configured to abut fourth surface, and second section, mounted on the third surface.