The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2004

Filed:

Jun. 20, 2001
Applicant:
Inventors:

Sudipta K. Ray, Wappingers Falls, NY (US);

Mitchell S. Cohen, Bedford, MA (US);

Lester Wynn Herron, New Paltz, NY (US);

Mario J. Interrante, New Paltz, NY (US);

Thomas E. Lombardi, Poughkeepsie, NY (US);

Subhash L. Shinde, Cortland Manor, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/14763 ; G02B 6/12 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/14763 ; G02B 6/12 ;
Abstract

A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.


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