The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Sep. 16, 2009
Minhua LU, Mohegan Lake, NY (US);
Eric D. Pefecto, Poughkeepsie, NY (US);
David L. Questad, Hopewell Junction, NY (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
Minhua Lu, Mohegan Lake, NY (US);
Eric D. Pefecto, Poughkeepsie, NY (US);
David L. Questad, Hopewell Junction, NY (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A microcircuit article of manufacture comprises an electrical conductor electrically connected to both a first microcircuit element at a site comprising a first connector site having a first connector site axis and a second microcircuit element at a site comprising a second connector site having a second connector site axis. The first microcircuit element and the second microcircuit element are separated by and operatively associated with a layer comprising a first electrical insulator, whereas the conductor and the first microcircuit element are separated by and operatively associated with a layer comprising a second electrical insulator. At least one of the first electrical insulator layer and the second electrical insulator layer comprise a polymeric electrical insulator. In another embodiment, both electrical insulator layers comprise polymeric insulator layers. The microcircuit includes a UBM and solder connection to a FBEOL via opening. Sufficiently separating the first connector site axis and the second connector site axis so they are not concentric decouples the UBM and solder connection to the FBEOL via opening to substantially eliminate or minimize inter alia, electromigration and the white bump problem typical of lead free solders employed in C4 systems. A process comprises manufacturing this type of microcircuit article.