Armonk, NY, United States of America

Eric D Pefecto

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2012-2013.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 20(Granted Patents)


Location History:

  • Poughkeepsie, NY (US) (2012)
  • Armonk, NY (US) (2013)

Company Filing History:


Years Active: 2012-2013

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2 patents (USPTO):Explore Patents

Title: Eric D Pefecto: Innovator in Microcircuit Technology

Introduction

Eric D Pefecto is a notable inventor based in Armonk, NY (US). He has made significant contributions to the field of microcircuit technology, holding 2 patents that showcase his innovative approach to electrical conductors and microcircuit elements.

Latest Patents

Pefecto's latest patents include advancements in Robust FBEOL and UBM structures of C4 interconnects. These patents describe an electrical conductor connected to two microcircuit elements, which are separated by electrical insulator layers. The design aims to minimize issues such as electromigration and the white bump problems commonly associated with lead-free solders in C4 systems. His work emphasizes the importance of decoupling connector site axes to enhance the reliability of microcircuit connections.

Career Highlights

Eric D Pefecto is currently employed at International Business Machines Corporation (IBM), where he continues to develop innovative solutions in microcircuit technology. His expertise in the field has positioned him as a key contributor to advancements in electrical engineering.

Collaborations

Pefecto has collaborated with notable colleagues, including Minhua Lu and David L Questad, to further enhance the development of microcircuit technologies.

Conclusion

Eric D Pefecto's contributions to microcircuit technology through his patents and work at IBM highlight his role as an influential inventor in the field. His innovative designs continue to address critical challenges in electrical engineering.

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