The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Apr. 14, 2005
Mukta G. Farooq, Hopewell Junction, NY (US);
Benjamin V. Fasano, New Windsor, NY (US);
Jason L. Frankel, Wappingers Falls, NY (US);
Harvey C. Hamel, Poughkeepsie, NY (US);
Suresh D Kadakia, Poughkeepsie, NY (US);
David C. Long, Wappingers Falls, NY (US);
Frank L. Pompeo, Redding, CT (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
Benjamin V. Fasano, New Windsor, NY (US);
Jason L. Frankel, Wappingers Falls, NY (US);
Harvey C. Hamel, Poughkeepsie, NY (US);
Suresh D Kadakia, Poughkeepsie, NY (US);
David C. Long, Wappingers Falls, NY (US);
Frank L. Pompeo, Redding, CT (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.