The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2001
Filed:
Jun. 06, 2000
Raymond A. Jackson, Fishkill, NY (US);
Anson J. Call, Poughkeepsie, NY (US);
Mark G. Courtney, Poughkeepsie, NY (US);
Stephen A. DeLaurentis, Claverack, NY (US);
Mukta S. Farooq, Hopewell Junction, NY (US);
Shaji Farooq, Hopewell Junction, NY (US);
Lewis S. Goldmann, Bedford, NY (US);
Gregory B. Martin, Wappingers Falls, NY (US);
Sudipta K. Ray, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.