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For the Inventor, By the Inventor

Fishkill, NY, United States of America

Raymond A Jackson

USPTO Granted Patents = 30

Average Co-Inventor Count = 5.4

ph-index = 12

Forward Citations = 395(Granted Patents)


Location History:

  • Wappingers Falls, NY (US) (1992 - 1996)
  • Dutchess County, NY (US) (1997)
  • Poughkeepsie, NY (US) (1995 - 2001)
  • Fishkill, NY (US) (1999 - 2003)
  • Beacon, NY (US) (2003 - 2004)

Company Filing History:

goldMedal30 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1992-2004

where 'Filed Patents' based on already Granted Patents

30 patents (USPTO):
1. 6719188 - Rework methods for lead BGA/CGA (2004-04-13),
2. 6548175 - Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof (2003-04-15),
3. 6541305 - Single-melt enhanced reliability solder element interconnect (2003-04-01),
4. 6528352 - Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications (2003-03-04),
5. 6497357 - Apparatus and method for removing interconnections (2002-12-24),
6. 6458623 - Conductive adhesive interconnection with insulating polymer carrier (2002-10-01),
7. 6360938 - Process and apparatus to remove closely spaced chips on a multi-chip module (2002-03-26),
8. 6335210 - Baseplate for chip burn-in and/of testing, and method thereof (2002-01-01),
9. 6333563 - Electrical interconnection package and method thereof (2001-12-25),
10. 6283359 - Method for enhancing fatigue life of ball grid arrays (2001-09-04),
11. 6278184 - Solder disc connection (2001-08-21),
12. 6259155 - Polymer enhanced column grid array (2001-07-10),
13. 6253986 - Solder disc connection (2001-07-03),
14. 6226863 - Reworkability method for wirebond chips using high performance capacitor (2001-05-08),
15. 6216937 - Process and apparatus to remove closely spaced chips on a multi-chip module (2001-04-17),

Title: Spotlight on Inventor Raymond A. Jackson from Fishkill, NY

Introduction:

Raymond A. Jackson, a prolific inventor based in Fishkill, NY, has made significant contributions to the field of electronic component assembly with an impressive portfolio of 30 patents. His innovative rework methods and electrically conductive adhesives have garnered recognition in the industry for their advanced techniques and reliability.

Latest Patents:

One of Raymond A. Jackson's recent patents includes a groundbreaking method for reworking electronic component assemblies. By using a cutting device with a heated wire or a water jet, solder interconnections can be efficiently severed, allowing for precise rework of electronic components. Another notable patent focuses on epoxy-siloxanes based electrically conductive adhesives, revolutionizing solder-free interconnections in microelectronic assembly processes.

Career Highlights:

Raymond A. Jackson is a key figure at IBM, where he continues to drive innovation and spearhead projects that push the boundaries of electronic component assembly. His expertise and creative solutions have positioned him as a leader in the field, shaping the future of semiconductor assembly processes.

Collaborations:

Throughout his career, Raymond A. Jackson has collaborated with esteemed colleagues such as Sudipta Kumar Ray and Peter Jeffrey Brofman. Together, they have worked on cutting-edge projects that have set new standards in electronic component assembly techniques and materials.

Conclusion:

Raymond A. Jackson's passion for innovation and dedication to advancing electronic component assembly technologies have solidified his reputation as a visionary inventor. His patents and contributions continue to inspire and shape the industry, paving the way for future advancements in electronic manufacturing.

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