The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Sep. 22, 1999
Peter J. Brofman, Hopewell Junction, NY (US);
Patrick A. Coico, Fishkill, NY (US);
Mark G. Courtney, Poughkeepsie, NY (US);
Lewis S. Goldmann, Bedford, NY (US);
Raymond A. Jackson, Fishkill, NY (US);
William E. Sablinski, Beacon, NY (US);
Kathleen A. Stalter, Hopewell Junction, NY (US);
Hilton T. Toy, Wappingers Falls, NY (US);
Li Wang, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.