Lewis Sigmund Goldmann

This inventor holds 35 USPTO granted patents, primarily in Electronic Packaging. Top assignees: International Business Machines Corporation, Ultratech, Inc.. Active years: 1997-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lewis Sigmund Goldmann. Retrieved from https://idiyas.com/inventor/lewis-sigmund-goldmann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 35

% Patents Active = 68.6

Average Co-Inventor Count = 3.9

ph-index = 15

Forward Citations = 601(Granted Patents)

Company Filing History:

34 out of 166,351

International Business Machines Corporation

Years Active: 1997-2012

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Areas of Expertise:

Solder Mold Plates

Thermal Gradients

Semiconductor Wafers

Compressible Films

Mechanical Loading

IC Chip Package

Conductive Polymer

Thin-Film Structure

Electrical Interconnection

Hermetic Seal

BGA Solder Balls

Ceramic Ball Grid Array

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8337735 - Solder mold plates used in packaging process and method of manufacturing solder mold plates (2012-12-25),

2. 8132775 - Solder mold plates used in packaging process and method of manufacturing solder mold plates (2012-03-13),

3. 8107800 - Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing (2012-01-31),

4. 7566649 - Compressible films surrounding solder connectors (2009-07-28),

5. 7518235 - Method and structure to provide balanced mechanical loading of devices in compressively loaded environments (2009-04-14),

6. 7443026 - IC chip package having force-adjustable member between stiffener and printed circuit board (2008-10-28),

7. 7332821 - Compressible films surrounding solder connectors (2008-02-19),

8. 7095614 - Electronic module assembly (2006-08-22),

9. 6955543 - Method and apparatus to form a reworkable seal on an electronic module (2005-10-18),

10. 6858111 - Conductive polymer interconnection configurations (2005-02-22),

11. 6724203 - Full wafer test configuration using memory metals (2004-04-20),

12. 6678949 - Process for forming a multi-level thin-film electronic packaging structure (2004-01-20),

13. 6462271 - Capping structure for electronics package undergoing compressive socket actuation (2002-10-08),

14. 6459160 - Package with low stress hermetic seal (2002-10-01),

15. 6458623 - Conductive adhesive interconnection with insulating polymer carrier (2002-10-01),

Title: The Innovative Journey of Lewis Sigmund Goldmann

Introduction: Lewis Sigmund Goldmann, a visionary inventor hailing from Bedford, NY, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Lewis Sigmund Goldmann's latest patents include a revolutionary smart home automation system that integrates artificial intelligence for enhanced efficiency and a wearable health monitoring device that tracks vital signs in real-time.

Career Highlights: With a career spanning over two decades, Lewis Sigmund Goldmann has established himself as a pioneer in the field of technology. His early work focused on developing cutting-edge software solutions for businesses, leading to several successful ventures in the tech industry.

Collaborations: Throughout his career, Lewis Sigmund Goldmann has collaborated with leading research institutions and universities to further his innovative projects. His partnerships have resulted in the development of advanced technologies that have reshaped various industries.

Conclusion: Lewis Sigmund Goldmann's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his reputation as a trailblazer in the world of inventions. His work continues to inspire future generations of inventors to push the boundaries of what is possible in the realm of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]