The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Aug. 20, 2004
William E. Bernier, Endwell, NY (US);
Tien-jen Cheng, Bedford, NY (US);
Marie S. Cole, Wappingers Falls, NY (US);
David E. Eichstadt, Chicago, IL (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
John A. Fitzsimmons, Poughkeepsie, NY (US);
Lewis S. Goldmann, Bedford, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Tasha E. Lopez, Santa Ana, CA (US);
David J. Welsh, Salt Point, NY (US);
William E. Bernier, Endwell, NY (US);
Tien-Jen Cheng, Bedford, NY (US);
Marie S. Cole, Wappingers Falls, NY (US);
David E. Eichstadt, Chicago, IL (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
John A. Fitzsimmons, Poughkeepsie, NY (US);
Lewis S. Goldmann, Bedford, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Tasha E. Lopez, Santa Ana, CA (US);
David J. Welsh, Salt Point, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.