Location History:
- Beford, NY (US) (2010)
- Hopewell Junction, NY (US) (2013)
- Bedford, NY (US) (1998 - 2017)
Company Filing History:
30 out of 164,108 
2 out of 131,214 
1 out of 12,867 
Years Active: 1998-2017
Tien-Jen Cheng: Pioneering Innovator in Integrated Circuit Bonding
Introduction:
In the world of integrated circuits, Tien-Jen Cheng has established himself as a leading innovator. With 33 patents to his name, Cheng has made significant contributions in the field of metal to metal bonding for stacked (3D) integrated circuits. Let's dive deeper into his latest patents, career highlights, and notable collaborations.
Latest Patents:
Cheng's latest patents showcase his expertise in developing metal to metal bonding techniques for 3D stacked chips. His inventions introduce a stabilized fine textured metal microstructure that serves as a durable activated surface for bonding. Notably, a fine-grain layer is employed to resist self-annealing, enabling metal to metal bonding at moderate temperatures and timeframes, while also offering enhanced process flexibility. These innovations play a pivotal role in advancing the reliability and performance of 3D integrated circuits.
Career Highlights:
Throughout his career, Cheng has made substantial contributions to the industry while working with renowned companies such as IBM and Samsung Electronics. His work at IBM, known as "International Business Machines Corporation," has been instrumental in driving advancements in the field of integrated circuits. Cheng's expertise in metal bonding technologies has paved the way for more efficient manufacturing processes and improved end products.
Collaborations:
Cheng's collaborations with fellow innovators have further amplified his impact in the field. Notable coworkers include Mukta G Farooq and David E Eichstadt, who have assisted him in developing groundbreaking technologies. These collaborations exemplify the collaborative nature of innovation and highlight the collective efforts required to push the boundaries of integrated circuit bonding.
Conclusion:
Tien-Jen Cheng's formidable expertise and numerous patents in metal to metal bonding for stacked integrated circuits have undoubtedly positioned him as a pioneering force in the industry. His inventions have not only improved the efficiency and reliability of 3D integrated circuits but have also opened up new avenues for potential advancements in the field. Cheng's professional journey and collaborations underscore the importance of fostering a collaborative environment to drive innovation and technological progress.
To explore more about Tien-Jen Cheng's patents, career, and collaborations, visit iDIYas.com, the ultimate destination for innovation and patent exploration.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.