Trademarks = 1

Forward Citations = 0

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9 inventors (with patents filed for the assignee):

Kamalesh K Srivastava (1 out of 38 patents)

Tien-Jen Cheng (1 out of 33 patents)

Jonathan H Griffith (1 out of 18 patents)

4. Roger A Quinn (1 out of 1 patent)

5. Julie C Biggs (1 out of 5 patents)

6. David E Eichstadt (1 out of 12 patents)

7. Sarah Huffsmith Knickerbocker (1 out of 39 patents)

8. Subhash Laxman Shinde (1 out of 47 patents)

9. William Edward Sablinski (1 out of 25 patents)

1 patent: Sort by Forward Citations

1. 7767575 - Forming robust solder interconnect structures by reducing effects of seed layer underetching (2010-08-03),

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

1 Patents

#1,502 in San Jose, CA

#29,047 in California

#136,844 in US

San Jose, CA, United States of America

Tessera Intellectual Properties, Inc.

Forward Citations = 0

9 inventors:

Kamalesh K Srivastava (1 out of 38 patents)

Tien-Jen Cheng (1 out of 33 patents)

Jonathan H Griffith (1 out of 18 patents)

4. Roger A Quinn (1 out of 1 patent)

5. Julie C Biggs (1 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Tessera Intellectual Properties, Inc.. Retrieved from https://idiyas.com/company/tessera-intellectual-properties

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]