The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Aug. 11, 2003
Gaetano P. Messina, Hopewell Junction, NY (US);
Patrick A. Coico, Fishkill, NY (US);
Lewis S. Goldmann, Bedford, NY (US);
Richard F. Indyk, Wappingers Falls, NY (US);
Vladimir Jambrih, Kingston, NY (US);
Jeffrey A. Zitz, Poughkeepsie, NY (US);
Gaetano P. Messina, Hopewell Junction, NY (US);
Patrick A. Coico, Fishkill, NY (US);
Lewis S. Goldmann, Bedford, NY (US);
Richard F. Indyk, Wappingers Falls, NY (US);
Vladimir Jambrih, Kingston, NY (US);
Jeffrey A. Zitz, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.