The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7518235 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 14, 2009

Filed:

Mar. 08, 2005
Applicants:

Patrick A. Coico, Fishkill, NY (US);

David L. Edwards, Poughkeepsie, NY (US);

Benjamin V. Fasano, New Windsor, NY (US);

Lewis S. Goldmann, Bedford, NY (US);

Ellyn M. Ingalls, Danbury, CT (US);

Michael S. June, Raleigh, NC (US);

Hilton T. Toy, Hopewell Junction, NY (US);

Paul A. Zucco, Saugerties, NY (US);

Inventors:

Patrick A. Coico, Fishkill, NY (US);

David L. Edwards, Poughkeepsie, NY (US);

Benjamin V. Fasano, New Windsor, NY (US);

Lewis S. Goldmann, Bedford, NY (US);

Ellyn M. Ingalls, Danbury, CT (US);

Michael S. June, Raleigh, NC (US);

Hilton T. Toy, Hopewell Junction, NY (US);

Paul A. Zucco, Saugerties, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.


Find Patent Forward Citations

Loading…