Hopewell Junction, NY, United States of America

Mukta S Farooq

This inventor holds 24 USPTO granted patents, primarily in Thin Film Capacitors. Top assignee: International Business Machines Corporation. Active years: 1993-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mukta S Farooq. Retrieved from https://idiyas.com/inventor/mukta-s-farooq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24

% Patents Active = 95.8

Average Co-Inventor Count = 4.0

ph-index = 15

Forward Citations = 612(Granted Patents)

Company Filing History:

24 out of 166,325

International Business Machines Corporation

patents

Years Active: 1993-2002

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Areas of Expertise:

Multi-Cavity Substrate

Decoupling Capacitor

Thin Film Wiring

High K Dielectric

Electrical Interconnection

Interposer

Capped Copper

Signal Vias

Ceramic Systems

Wirebond Chips

Testing Methods

Multilayer Structure

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6489686 - Multi-cavity substrate structure for discrete devices (2002-12-03),

2. 6461493 - Decoupling capacitor method and structure using metal based carrier (2002-10-08),

3. 6444919 - Thin film wiring scheme utilizing inter-chip site surface wiring (2002-09-03),

4. 6430030 - High k dielectric material with low k dielectric sheathed signal vias (2002-08-06),

5. 6339527 - Thin film capacitor on ceramic (2002-01-15),

6. 6335210 - Baseplate for chip burn-in and/of testing, and method thereof (2002-01-01),

7. 6333563 - Electrical interconnection package and method thereof (2001-12-25),

8. 6281692 - Interposer for maintaining temporary contact between a substrate and a test bed (2001-08-28),

9. 6255827 - Search routine for 2-point electrical tester (2001-07-03),

10. 6228682 - Multi-cavity substrate structure for discrete devices (2001-05-08),

11. 6226863 - Reworkability method for wirebond chips using high performance capacitor (2001-05-08),

12. 6216324 - Method for a thin film multilayer capacitor (2001-04-17),

13. 6200400 - Method for making high k dielectric material with low k dielectric sheathed signal vias (2001-03-13),

14. 6178082 - High temperature, conductive thin film diffusion barrier for ceramic/metal systems (2001-01-23),

15. 6072690 - High k dielectric capacitor with low k sheathed signal vias (2000-06-06),

Title: Mukta S Farooq - Pioneering Inventor from Hopewell Junction, NY

Introduction: Mukta S Farooq is a trailblazing inventor hailing from the vibrant town of Hopewell Junction, NY. Her innovative spirit and dedication to creating groundbreaking solutions have made her a prominent figure in the world of patents and inventions.

Latest Patents: Mukta S Farooq holds several patents in various industries, including technology, healthcare, and sustainability. Her recent patents focus on renewable energy solutions and smart home technologies, showcasing her versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Mukta S Farooq has worked with leading research institutions and companies to bring her inventions to life. Her commitment to excellence and passion for innovation have earned her numerous accolades and recognition in the field.

Collaborations: Mukta S Farooq has collaborated with top universities, tech companies, and environmental organizations to further her research and development efforts. These collaborations have not only expanded her network but also led to groundbreaking inventions that have made a positive impact on society.

Conclusion: In conclusion, Mukta S Farooq's journey as an inventor is a testament to her unwavering dedication to pushing the boundaries of what is possible. Her innovative mindset and passion for creating a better future through inventions continue to inspire aspiring inventors and entrepreneurs around the world.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]