Hyde Park, NY, United States of America

Hal Mitchell Lasky


Average Co-Inventor Count = 12.0

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 1999-2002

where 'Filed Patents' based on already Granted Patents

3 patents (USPTO):

Title: Hal Mitchell Lasky: Innovator in Copper-Based Technologies

Introduction

Hal Mitchell Lasky is a notable inventor based in Hyde Park, NY (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative work on copper-based materials. With a total of three patents to his name, Lasky has established himself as a key figure in the industry.

Latest Patents

Lasky's latest patents focus on a copper-based paste that contains copper aluminate, designed for microstructural and shrinkage control of copper-filled vias. This paste is specifically formulated for filling vias and forming conductive surface patterns on ceramic substrate packages used in semiconductor chip devices. The unique composition of the paste ensures that the shrinkage of the copper material during sintering closely matches that of the ceramic substrate, thereby enhancing the performance and reliability of the devices.

Career Highlights

Lasky is currently employed at International Business Machines Corporation (IBM), where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.

Collaborations

Throughout his career, Lasky has collaborated with esteemed colleagues, including Farid Youssif Aoude and Lawrence D David. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Hal Mitchell Lasky is a distinguished inventor whose work in copper-based technologies has made a significant impact on the semiconductor industry. His contributions continue to shape the future of electronic devices, ensuring their efficiency and reliability.

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