The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Dec. 12, 2007
Jerry A. Gorrell, Lagrangeville, NY (US);
Sarah H. Knickerbocker, Hopewell Junction, NY (US);
Srinivasa S. N. Reddy, Lagrangeville, NY (US);
Jerry A. Gorrell, Lagrangeville, NY (US);
Sarah H. Knickerbocker, Hopewell Junction, NY (US);
Srinivasa S. N. Reddy, Lagrangeville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method is provided for the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and determines if any off-set resulted between the solder mold array and the wafer capture array during the transfer process. The amount of off-set enables the operator to adjust the transfer tool before solder transfer to compensate for the off-set caused by the transfer process and provides a more cost-effective and efficient solder transfer process. A solder reactive material surrounding the capture pads is used to determine where the solder reacts with the solder reactive material showing the off-set resulting from the transfer process. Copper is a preferred solder reactive material.