Jerry A Gorrell

Title: Innovations by Jerry A. Gorrell: A Glimpse into His Patents and Contributions

Introduction

Jerry A. Gorrell, an accomplished inventor based in Lagrangeville, NY, has made significant contributions to the field of electronic device manufacturing. With a portfolio of three patents, Gorrell's work focuses on methods that enhance the reliability and efficiency of interconnect solder bump production, particularly in relation to the advanced C4NP technology.

Latest Patents

Gorrell’s latest innovations include two key patents that address critical aspects of interconnect solder bump fabrication. The first patent is titled "Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface." This patented method facilitates the production of solder bumps without depositing unwanted tin or solder components onto the wafer, thus avoiding potential shorts or defects. By utilizing a controlled reducing gas flow, the process effectively removes oxides from the solder and wafer pad surfaces, ensuring a clean transfer of solder without contamination.

The second patent, "Alignment verification for C4NP solder transfer," outlines a technique that determines any offsets between the solder mold array and the wafer capture array during the transfer process. By incorporating a solder reactive material around the capture pads, this method enables precise adjustments before solder transfer, enhancing both cost-effectiveness and efficiency.

Career Highlights

Throughout his career, Jerry A. Gorrell has been a pivotal contributor at the International Business Machines Corporation (IBM), a leader in technological innovation. His expertise in electronic manufacturing processes has not only advanced the capabilities of IBM but also set new standards within the industry.

Collaborations

Gorrell has collaborated with talented coworkers including Christopher Lee Tessler and Sarah Huffsmith Knickerbocker. These collaborations have fostered a creative environment where innovative ideas are transformed into practical applications, further enhancing the team's contributions to the field.

Conclusion

In conclusion, Jerry A. Gorrell exemplifies the spirit of innovation through his patents and contributions to electronic device production. His work on solder bump manufacturing techniques not only improves product reliability but also reflects a commitment to advancing technology at IBM. Gorrell's achievements stand as a testament to the impact that dedicated inventors can have in the realm of technology and engineering.