The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Sep. 07, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 28/00 (2006.01); B23K 35/362 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); B23K 1/0016 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/362 (2013.01); C22C 28/00 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/296 (2013.01); H01L 23/3157 (2013.01); H01L 23/49838 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); B23K 2201/40 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/8112 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/351 (2013.01);
Abstract
Embodiments of the present invention provide an improved method and structure for flip chip implementation. The interconnections between the electronic circuit (e.g. silicon die) and the circuit board substrate are comprised of a metal alloy that becomes liquid at the operating temperature of the chip. This allows a softer underfill to be used, which in turn reduces stresses during operation and thermal cycling that are caused by the different coefficient of thermal expansion (CTE) of the electronic circuit chip and the circuit board substrate.