The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Feb. 15, 2011
Applicant:
Julien Sylvestre, Chambly, CA;
Inventor:
Julien Sylvestre, Chambly, CA;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 21/607 (2006.01); B23K 1/06 (2006.01); B23K 1/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/75272 (2013.01); B23K 1/06 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75841 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/16225 (2013.01); B23K 1/0016 (2013.01); H01L 2224/81169 (2013.01); H01L 2224/1416 (2013.01); H01L 24/16 (2013.01); H01L 2224/75801 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81149 (2013.01); H01L 2224/759 (2013.01);
Abstract
A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.