The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Apr. 29, 2008
James a Busby, New Paltz, NY (US);
Minhua LU, Mohegan Lake, NY (US);
Valerie a Oberson, Quebec, CA;
Eric D Perfecto, Poughkeepsie, NY (US);
Kamalesh K Srivastava, Wappingers Falls, NY (US);
Brian R Sundlof, Verbank, NY (US);
Julien Sylvestre, Quebec, CA;
Renee L Weisman, Poughkeepsie, NY (US);
James A Busby, New Paltz, NY (US);
Minhua Lu, Mohegan Lake, NY (US);
Valerie A Oberson, Quebec, CA;
Eric D Perfecto, Poughkeepsie, NY (US);
Kamalesh K Srivastava, Wappingers Falls, NY (US);
Brian R Sundlof, Verbank, NY (US);
Julien Sylvestre, Quebec, CA;
Renee L Weisman, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.