The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Oct. 28, 2014
International Business Machines Corporation, Armonk, NY (US);
Julien Sylvestre, Chambly, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
An assembly of a semiconductor chip having pads to a substrate having pads aligned to receive the semiconductor chip is provided, whereby at least one of the semiconductor chip pads and substrate pads include solder bumps. The solder bumps are deformed against the substrate pads and the semiconductor chip pads, whereby an underfill material is applied to fill the gap between the semiconductor chip and substrate such that the underfill material envelopes both the deformed solder bumps and the substrate pads. The underfill material does not penetrate between the deformed solder bumps, the semiconductor chip pads, and the substrate pads based on a compression force causing the solder bumps to be deformed against the substrate pads and the semiconductor chip pads. At least one of the solder bumps have not been melted or reflowed to make a metallurgical bond between the semiconductor chip pads and the substrate pads.