The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Feb. 19, 2019
International Business Machines Corporation, Armonk, NY (US);
Max S. Cioban, Wappingers Falls, NY (US);
Jonathan Fry, Fishkill, NY (US);
Michael Rizzolo, Delmar, NY (US);
Tuhin Sinha, Oradell, NJ (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An integrated circuit (IC) device, such as a wafer, die, or the like, includes a viscoelastic pad upon a contact. The viscoelastic pad includes a viscoelastic material and an electrically conductive material within the viscoelastic material. The viscoelastic pad provides for a probe needle of an IC device tester to be electrically connected to the IC device contact without the probe needle directly contacting the IC device contact. The viscoelastic pad may be probed multiple instances by the probe needle and may be washed or otherwise removed from the IC device after testing is completed. The viscoelastic pad may be formed upon the IC device by forming the viscoelastic material within a mask, aligning the viscoelastic pad to the IC device contact, and ejecting the viscoelastic material from the mask upon the IC device contact.