The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Mar. 12, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Marcus E. Interrante, Highland, NY (US);

Sushumna Iruvanti, Wappingers Falls, NY (US);

Shidong Li, Hopewell Junction, NY (US);

Tuhin Sinha, Oradell, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3733 (2013.01); H01L 21/4882 (2013.01); H01L 23/3185 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01);
Abstract

Embodiments of the present invention relate to an heterogenous thermal interface material (TIM). The heterogenous TIM includes two or more different materials. One material has a low elastic modulus, also known as Young's modulus, and is utilized primarily to transfer heat from one component to another component. Another material has a higher elastic modulus and is primarily utilized to bond or connect the corners and/or edges of one component to the other component. The high elastic modulus material is generally located within the heterogenous TIM where TIM strain is or is expected to be high. For example, the high elastic modulus material may be located at the corner and/or edge regions of the heterogenous TIM.


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