The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
Oct. 02, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/522 (2006.01); H01L 21/48 (2006.01); H01L 21/54 (2006.01); G01R 31/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); G01R 31/2853 (2013.01); H01L 21/4853 (2013.01); H01L 21/54 (2013.01); H01L 23/5222 (2013.01);
Abstract
Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.
Quick Actions:
Davis, Taryn. (2020). Method and structure for flip-chip package reliability monitoring using capacitive sensors groups (U.S. Patent No. 10553503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10553503
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile