The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Jan. 27, 2020
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Shidong Li, Hopewell Junction, NY (US);
Jay A. Bunt, Esopus, NY (US);
Kenneth C. Marston, Poughquag, NY (US);
Hilton Toy, Hopewell Junction, NY (US);
Hongqing Zhang, Hopewell Junction, NY (US);
David J. Lewison, LaGrangeville, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 23/04 (2013.01); H01L 23/562 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/35121 (2013.01);
Abstract
An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.