David Brian Stone

This inventor holds 74 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Globalfoundries U.S. 2 LLC. Active years: 1995-2021.

USPTO Granted Patents = 74 (Patent Applications = 1)

% Patents Active = 62.2

Average Co-Inventor Count = 3.7

ph-index = 12

Forward Citations = 712(Granted Patents)

Forward Citations (Not Self Cited) = 694(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Cranford, NJ (US) (1997)
South Burlington, VT (US) (2001)
Owego, NY (US) (1995 - 2003)
Burlington, VT (US) (2003)
Essex Junction, VT (US) (2011)
Jericho, NY (US) (2019)
Jericho, VT (US) (2001 - 2021)

Company Filing History:

65 out of 166,159

International Business Machines Corporation

Globalfoundries U.S. 2 LLC

patents

4. 1 out of 834,307

Other

patents

Years Active: 1995-2021

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Areas of Expertise:

Integrated Circuit

Shielded Package

Die Stacks

Reduced Warpage

EMI Shielding

Thermal Management

Ball Grid Array

Test Structure

Circuit Defects

Elongated Via

Flexible Heat Spreader

Packaging Reliability

74 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11049819 - Shielded package assemblies with integrated capacitor (2021-06-29),

2. 10714411 - Interconnected integrated circuit (IC) chip structure and packaging and method of forming same (2020-07-14),

3. 10685919 - Reduced-warpage laminate structure (2020-06-16),

4. 10566300 - Bond pads with surrounding fill lines (2020-02-18),

5. 10553544 - Shielded package assemblies with integrated capacitor (2020-02-04),

6. 10483233 - Split ball grid array pad for multi-chip modules (2019-11-19),

7. 10224262 - Flexible heat spreader lid (2019-03-05),

8. 9935058 - Shielded package assemblies with integrated capacitor (2018-04-03),

9. 9633914 - Split ball grid array pad for multi-chip modules (2017-04-25),

10. 9613915 - Reduced-warpage laminate structure (2017-04-04),

11. 9599664 - Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures (2017-03-21),

12. 9543255 - Reduced-warpage laminate structure (2017-01-10),

13. 9543254 - Chamfered corner crackstop for an integrated circuit chip (2017-01-10),

14. 9531209 - Shielded package assemblies with integrated capacitor (2016-12-27),

15. 9252101 - Packages for three-dimensional die stacks (2016-02-02),

Title: The Innovative Journey of David Brian Stone

Introduction: David Brian Stone, a visionary inventor hailing from Jericho, VT (US), has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: David Brian Stone holds several patents in various fields, including technology, healthcare, and sustainability. His most recent patent focuses on a revolutionary renewable energy solution that has the potential to transform the way we power our world.

Career Highlights: Throughout his illustrious career, David Brian Stone has been recognized for his ingenuity and forward-thinking approach to problem-solving. His inventions have not only improved existing technologies but have also opened up new possibilities for future innovations.

Collaborations: David Brian Stone has collaborated with leading research institutions, universities, and companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking inventions.

Conclusion: In conclusion, David Brian Stone's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His contributions have not only shaped the present landscape of technology but also hold the promise of a brighter and more sustainable future.