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For the Inventor, By the Inventor

Singapore, Singapore

Teck Kheng Lee

This inventor holds 68 USPTO granted patents and 3 published patent applications and 3 EPO patents, primarily in Microelectronic Devices (CPC class H01L). Top assignees: Micron Technology Incorporated, Institute of Technical Education. Active years: 2003-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teck Kheng Lee. Retrieved from https://idiyas.com/inventor/teck-kheng-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 68 

% Patents Active = 80.9

 

Average Co-Inventor Count = 1.4

ph-index = 17

Forward Citations = 952(Granted Patents)

Forward Citations (Not Self Cited) = 895(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal67 out of 39,176 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 2 
 
Institute of Technical Education
 patents

Years Active: 2003-2019

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Areas of Expertise:
Microelectronic Devices
Semiconductor Assemblies
Fluxless Solder
Interposer Technology
Die Stacking
Thermal Enhancement
Packaging Methods
Through-Substrate Vias
Flexible Materials
Lead Frame
Device Manufacturing
Microfeature Workpiece
68 patents (USPTO):Explore Patents
1. 10515918 - Methods of fluxless micro-piercing of solder balls, and resulting devices (2019-12-24),
2. 10163840 - Methods of fluxless micro-piercing of solder balls, and resulting devices (2018-12-25),
3. 9806013 - Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device (2017-10-31),
4. 9412677 - Computer systems having an interposer including a flexible material (2016-08-09),
5. 9153526 - Microelectronic devices and methods for manufacturing microelectronic devices (2015-10-06),
6. 9129862 - Microelectronic devices and microelectronic support devices, and associated assemblies and methods (2015-09-08),
7. 8778732 - Microelectronic devices and microelectronic support devices, and associated assemblies and methods (2014-07-15),
8. 8742572 - Microelectronic devices and methods for manufacturing microelectronic devices (2014-06-03),
9. 8669173 - Methods of fluxless micro-piercing of solder balls, and resulting devices (2014-03-11),
10. 8604598 - Microelectronic devices and methods for manufacturing microelectronic devices (2013-12-10),
11. 8536046 - Partitioned through-layer via and associated systems and methods (2013-09-17),
12. 8441113 - Elimination of RDL using tape base flip chip on flex for die stacking (2013-05-14),
13. 8436478 - Methods of fluxless micro-piercing of solder balls, and resulting devices (2013-05-07),
14. 8367538 - Partitioned through-layer via and associated systems and methods (2013-02-05),
15. 8310048 - Microelectronic devices (2012-11-13),

Title: Teck Kheng Lee: A Pioneer in Innovation Shaping the Future

Introduction:

Teck Kheng Lee, a visionary inventor based in Singapore, SG, with a remarkable portfolio of 68 patents, is known for his unwavering passion for innovation and his tireless dedication to excellence. His groundbreaking work continues to inspire the next generation of inventors and is instrumental in shaping the future of technology.

Latest Patents:

Among his latest patents is the innovative method of fluxless micro-piercing of solder balls and the resulting devices. This method revolutionizes the process of establishing conductive connections, particularly in integrated circuit dies. By effectively piercing solder balls and their oxide layers, Teck Kheng Lee's invention ensures a reliable and efficient means of creating vital connections in electronic devices.

Career Highlights:

Teck Kheng Lee's illustrious career spans significant contributions to renowned companies such as Micron Technology Incorporated and Micron Technology, Inc. His expertise and ingenuity have played a pivotal role in driving advancements in semiconductor technology, garnering him global recognition as a trailblazer in the field.

Collaborations:

Throughout his career, Teck Kheng Lee has collaborated with esteemed colleagues such as Kian Chai Lee and Sian Yong Khoo, who have been instrumental in realizing his innovative vision. Together, they have worked tirelessly to push the boundaries of technological possibilities and bring cutting-edge solutions to fruition.

Conclusion:

In conclusion, Teck Kheng Lee stands as a beacon of innovation, inspiring countless individuals with his groundbreaking inventions and relentless pursuit of excellence. His remarkable contributions to the field of technology have not only shaped the present landscape but also hold the promise of a future where innovation knows no bounds. Teck Kheng Lee's legacy continues to endure, leaving an indelible mark on the world of inventions and paving the way for a new era of technological advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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