The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Jul. 01, 2012
Applicants:

Karan Kacker, Atlanta, GA (US);

Douglas O. Powell, Endicott, NY (US);

David L. Questad, Hopewell Junction, NY (US);

David J. Russell, Owego, NY (US);

Sri M. Sri-jayantha, Ossining, NY (US);

Inventors:

Karan Kacker, Atlanta, GA (US);

Douglas O. Powell, Endicott, NY (US);

David L. Questad, Hopewell Junction, NY (US);

David J. Russell, Owego, NY (US);

Sri M. Sri-Jayantha, Ossining, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/09 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 1/116 (2013.01); H05K 3/4602 (2013.01); H01L 2224/16 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0271 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/096 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09536 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes an etched pattern.


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