Company Filing History:

5 out of 164,108

International Business Machines Corporation

patents

3 out of 2,072

Georgia Tech Research Corporation

patents

Years Active: 2012-2015

where 'Filed Patents' based on already Granted Patents

8 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9099458 - Construction of reliable stacked via in electronic substrates—vertical stiffness control method (2015-08-04),

2. 8866026 - Construction of reliable stacked via in electronic substrates—vertical stiffness control method (2014-10-21),

3. 8766449 - Variable interconnect geometry for electronic packages and fabrication methods (2014-07-01),

4. 8522430 - Clustered stacked vias for reliable electronic substrates (2013-09-03),

5. 8382489 - Compliant off-chip interconnects for use in electronic packages and fabrication methods (2013-02-26),

6. 8258410 - Construction of reliable stacked via in electronic substrates—vertical stiffness control method (2012-09-04),

7. 8242593 - Clustered stacked vias for reliable electronic substrates (2012-08-14),

8. 8206160 - Compliant off-chip interconnects for use in electronic packages (2012-06-26),

Title: Karan Kacker: Innovator in Electronic Substrates

Introduction

Karan Kacker is a prominent inventor based in Atlanta, GA (US). She has made significant contributions to the field of electronic substrates, holding a total of 8 patents. Her innovative work focuses on improving the reliability and performance of electronic components.

Latest Patents

Kacker's latest patents include a method for constructing reliable stacked vias in electronic substrates, specifically addressing vertical stiffness control. This stacked via structure is designed to reduce vertical stiffness and consists of a plurality of stacked vias, each situated on a disc-like structure. The disc-like structure features a platted through hole landing that supports the stacked vias and includes an etched pattern. Another notable aspect of her invention is the platted through hole landing, which has a thickness of approximately 3 micrometers and a copper top surface.

Career Highlights

Throughout her career, Karan Kacker has worked with esteemed organizations such as IBM and Georgia Tech Research Corporation. Her experience in these companies has allowed her to develop and refine her innovative ideas in electronic substrates.

Collaborations

Kacker has collaborated with notable individuals in her field, including Douglas Oliver Powell and David L Questad. These partnerships have contributed to her success and the advancement of her inventions.

Conclusion

Karan Kacker is a remarkable inventor whose work in electronic substrates has led to significant advancements in the industry. Her patents and collaborations reflect her dedication to innovation and excellence in her field.

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1 patent pending (EPO):

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