The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8258410 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 04, 2012

Filed:

Jan. 26, 2008
Applicants:

Karan Kacker, Atlanta, GA (US);

Douglas O. Powell, Endicott, NY (US);

David L. Questad, Hopewell Junction, NY (US);

David J. Russell, Owego, NY (US);

Sri M. Sri-jayantha, Ossining, NY (US);

Inventors:

Karan Kacker, Atlanta, GA (US);

Douglas O. Powell, Endicott, NY (US);

David L. Questad, Hopewell Junction, NY (US);

David J. Russell, Owego, NY (US);

Sri M. Sri-Jayantha, Ossining, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors for connecting the compliant center zone of the platted through hole landing.


Find Patent Forward Citations

Kacker, Karan. (2012). Construction of reliable stacked via in electronic substrates—vertical stiffness control method (U.S. Patent No. 8258410). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8258410

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…