The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Jul. 14, 2012
Karan Kacker, Atlanta, GA (US);
Douglas O. Powell, Endicott, NY (US);
David L. Questad, Hopewell Junction, NY (US);
David J. Russell, Owego, NY (US);
Sri M. Sri-jayantha, Ossining, NY (US);
Karan Kacker, Atlanta, GA (US);
Douglas O. Powell, Endicott, NY (US);
David L. Questad, Hopewell Junction, NY (US);
David J. Russell, Owego, NY (US);
Sri M. Sri-Jayantha, Ossining, NY (US);
International Business Macines Corporation, Armonk, NY (US);
Abstract
A method of fabricating a substrate via structure in a substrate/chip assembly includes steps of: disposing a center via stack for electrical interconnects in the substrate/chip assembly; and providing a plurality of stacked vias surrounding the center via stack. The plurality of stacked vias encircle the center via stack, resulting in no isolated via stacks on the structure. The plurality of stacked vias have both functional and non-functional vias.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile