The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Sep. 17, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Richard S. Graf, Gray, ME (US);
Douglas O. Powell, Endicott, NY (US);
David J. Russell, Owego, NY (US);
David J. West, Essex Junction, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/2686 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54453 (2013.01);
Abstract
Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.