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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Edmund D Blackshear

USPTO Granted Patents = 29 

Average Co-Inventor Count = 2.3

ph-index = 8

Forward Citations = 216(Granted Patents)


Location History:

  • Wappinges Falls, NY (US) (2015)
  • Wappinger Falls, NY (US) (2005 - 2017)
  • Wappingers Falls, NY (US) (1992 - 2022)

Company Filing History:

goldMedal22 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal5 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal2 out of 8 
 
Kyocera Circuit Solutions Inc.
 patents
4. 1 out of 5,162 
 
Marvell International Limited
 patents
5. 1 out of 1,694 
 
Shinko Electric Industries Co., Ltd.
 patents
6. 1 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1992-2022

where 'Filed Patents' based on already Granted Patents

29 patents (USPTO):
1. 11342697 - Dual-level pad card edge self-guide and alignment of connector (2022-05-24),
2. 10813215 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-20),
3. 10806030 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-13),
4. 10748852 - Multi-chip module (MCM) with chip-to-chip connection redundancy and method (2020-08-18),
5. 10687420 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-06-16),
6. 10598860 - Photonic die fan out package with edge fiber coupling interface and related methods (2020-03-24),
7. 9818682 - Laminate substrates having radial cut metallic planes (2017-11-14),
8. 9743526 - Wiring board with stacked embedded capacitors and method of making (2017-08-22),
9. 9659131 - Copper feature design for warpage control of substrates (2017-05-23),
10. 9543253 - Method for shaping a laminate substrate (2017-01-10),
11. 9305894 - Constrained die adhesion cure process (2016-04-05),
12. 9293439 - Electronic module assembly with patterned adhesive array (2016-03-22),
13. 9129942 - Method for shaping a laminate substrate (2015-09-08),
14. 9105535 - Copper feature design for warpage control of substrates (2015-08-11),
15. 9093563 - Electronic module assembly with patterned adhesive array (2015-07-28),

Title: The Legacy of Edmund D. Blackshear: Pioneering Inventor from Wappingers Falls

Introduction: Edmund D. Blackshear, a distinguished inventor hailing from Wappingers Falls, NY, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Edmund D. Blackshear holds several patents in the realm of telecommunications and renewable energy, showcasing his continuous dedication to pushing the boundaries of technological advancement.

Career Highlights: Throughout his illustrious career, Blackshear has held key positions in various tech companies, where he spearheaded projects that revolutionized the industry. His innovative mindset and strategic vision have led to the development of cutting-edge solutions that have transformed the way we interact with technology.

Collaborations: Blackshear has collaborated with leading researchers, engineers, and inventors from around the globe, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the creation of revolutionary products that have had a lasting impact on society.

Conclusion: In conclusion, Edmund D. Blackshear's unwavering passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and serve as a testament to the power of ingenuity and perseverance in driving positive change.

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