The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Dec. 03, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Edmund Blackshear, Wappingers Falls, NY (US);
Shidong Li, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 5/16 (2006.01); B32B 7/02 (2006.01); B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/38 (2006.01); B32B 37/02 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); B32B 3/26 (2006.01); B32B 38/00 (2006.01); B32B 37/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 13/00 (2006.01); H01L 21/48 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 3/08 (2006.01); B32B 3/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); B32B 3/266 (2013.01); B32B 7/02 (2013.01); B32B 37/02 (2013.01); B32B 37/182 (2013.01); B32B 38/0004 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); B32B 3/08 (2013.01); B32B 3/10 (2013.01); B32B 5/16 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/04 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); B32B 2250/05 (2013.01); B32B 2250/40 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/10 (2013.01); B32B 2264/101 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2307/734 (2013.01); B32B 2363/00 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); H01L 21/4803 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0271 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0206 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0929 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09209 (2013.01); H05K 2203/06 (2013.01); H05K 2203/061 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 428/24298 (2015.01); Y10T 428/24314 (2015.01); Y10T 428/24322 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/25 (2015.01);
Abstract
A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.