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Trademarks = 1

Forward Citations = 4

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12 inventors (with patents filed for the assignee):

Kenji Terada (3 out of 14 patents)

Charles L Reynolds (2 out of 23 patents)

Jean Audet (2 out of 37 patents)

4. Keizou Sakurai (2 out of 11 patents)

5. Masahiro Fukui (2 out of 3 patents)

6. Tomoyuki Yamada (2 out of 3 patents)

7. Edmund D Blackshear (2 out of 29 patents)

8. Hidetoshi Yugawa (1 out of 11 patents)

9. Makoto Shiroshita (1 out of 3 patents)

10. Takayuki Taguchi (1 out of 4 patents)

11. Mitsuzo Yokoyama (1 out of 1 patent)

12. Toshiaki Takagi (1 out of 1 patent)

8 patents: Sort by Forward Citations

1. 10813215 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-20),

2. 10806030 - Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance (2020-10-13),

3. 9326389 - Wiring board and method of manufacturing the same (2016-04-26),

4. 9295154 - Wiring board (2016-03-22),

5. 9282642 - Wiring board (2016-03-08),

6. 9237649 - Wiring board and method of manufacturing the same (2016-01-12),

7. 9173299 - Collective printed circuit board (2015-10-27),

8. 9157932 - Wiring board and probe card using the same (2015-10-13),

Kyocera Circuit Solutions Inc. is a global leader in the design and production of high-quality printed circuit boards for a wide range of industries. With a focus on innovation, reliability, and customer satisfaction, Kyocera Circuit Solutions Inc. provides advanced circuit solutions to meet the evolving needs of its customers. Combining cutting-edge technology with superior service, Kyocera Circuit Solutions Inc. is dedicated to delivering exceptional results for its clients around the world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

8 Patents

#1 in Yasu, Shiga

#4,917 in Japan

Yasu, Shiga, Japan

Kyocera Circuit Solutions Inc.