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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9173299 B1

PDFFull Text
Date of Patent:
Oct. 27, 2015

Filed:

Sep. 29, 2011

Collective printed circuit board

Applicants:

Keizou Sakurai, Yasu, JP;

Toshiaki Takagi, Yasu, JP;

Inventors:

Keizou Sakurai, Yasu, JP;

Toshiaki Takagi, Yasu, JP;

Assignee:

KYOCERA CIRCUIT SOLUTIONS, INC., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Ramon Barrera

Int. Cl.
CPC ...
H05K 7/14 (2006.01); H05K 3/00 (2006.01); H05K 1/14 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0052 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/5389 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H05K 1/144 (2013.01); H05K 3/0097 (2013.01); H01L 23/49816 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01); H05K 3/284 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/2018 (2013.01);
Abstract

There is provided a collective printed circuit board including a plurality of printed circuit boards each having a mounting unit on which a semiconductor element is mounted at an upper-surface central portion, and a frame having a plurality of through holes having sizes to surround the mounting portion. Upper-surface peripheral edge portions of the printed circuit boards and a through-hole peripheral portion of the frame are bonded to each other such that the mounting units are exposed from the through holes.

Find Patent Forward Citations

Sakurai, Keizou. (2015). Collective printed circuit board (U.S. Patent No. 9173299). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9173299

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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