Kyoto, Japan

Hidetoshi Yugawa


Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Shiga, JP (2013 - 2014)
  • Kyoto, JP (2016 - 2023)

Company Filing History:


Years Active: 2013-2025

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10 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Hidetoshi Yugawa**

Introduction

Hidetoshi Yugawa is a prominent inventor based in Kyoto, Japan, known for his significant contributions to the field of wiring boards. With a remarkable portfolio of 9 patents, his work continues to influence advancements in electronic circuit design and manufacturing.

Latest Patents

Among his latest innovations is a sophisticated wiring board that features a unique configuration. This design includes first and second insulating layers, a first wiring conductor layer with a first via land, and a second wiring conductor layer with a second via land. The innovation employs a via hole penetrating through the second insulating layer to ensure effective electrical connection between layers. Notably, a via conductor located within this hole establishes the connection using a two-tier base layer of nichrome, further enhanced by an alloy layer of tin and nichrome.

Another notable patent features a wiring board that consists of an insulating layer and various conductor layers composed of metals such as nickel, chromium, and copper. With the inclusion of a third conductor layer extending outward, capped by a fourth layer of gold, this design not only maximizes conductivity but also enhances durability and performance.

Career Highlights

Hidetoshi Yugawa has made considerable strides in his career, particularly during his tenure at Kyocera Corporation and Kyocera Circuit Solutions Inc. His work at these institutions has been crucial in developing advanced technologies for electronic components.

Collaborations

Throughout his career, Hidetoshi has collaborated with esteemed colleagues such as Yoshihiro Hosoi and Takayuki Taguchi. These partnerships have fostered an environment of innovation, leading to groundbreaking developments within the electronics industry.

Conclusion

Hidetoshi Yugawa stands as a testament to the spirit of innovation in Japan, particularly in the realm of wiring boards. His patents not only reflect his technical prowess but also his commitment to enhancing the efficiency and effectiveness of electronic designs, making a lasting impact on the field.

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