The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Sep. 13, 2018
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Masaaki Harazono, Kirishima, JP;

Takayuki Umemoto, Omihachiman, JP;

Hidetoshi Yugawa, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H01B 3/40 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/38 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4676 (2013.01); H01B 3/40 (2013.01); H05K 1/0284 (2013.01); H05K 1/0353 (2013.01); H05K 1/0373 (2013.01); H05K 1/11 (2013.01); H05K 1/119 (2013.01); H05K 3/0094 (2013.01); H05K 3/067 (2013.01); H05K 3/181 (2013.01); H05K 3/38 (2013.01); H05K 3/4602 (2013.01); H05K 1/0298 (2013.01); H05K 1/0313 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0358 (2013.01); H05K 2203/072 (2013.01);
Abstract

A wiring board includes a first insulating layer including a surface having unevenness, a second insulating layer including a surface having unevenness, laminated on the first insulating layer, and made of the same insulating material as that of the first insulating layer, insulating particles contained in the first and second insulating layers at rate of 40 to 80 wt %, a first wiring conductor on a first underlying metal layer surface, and a second wiring conductor on a second underlying metal layer surface. A second level difference of the unevenness in a surface region of the second insulating layer under the second wiring conductor is smaller than a first level difference of the unevenness in a surface region of the first insulating layer under the first wiring conductor, and the second level difference is not more than ⅖ of an average particle size of the insulating particles.


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