Masaaki Harazono is a prominent inventor based in Kirishima, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 13 patents. His innovative designs and methods have advanced the capabilities of electronic components.

Latest Patents

One of his latest patents involves a wiring board that includes a first insulating layer with a surface featuring unevenness, and a second insulating layer laminated on top, made from the same insulating material. This design incorporates insulating particles at a rate of 40 to 80 wt%. The wiring board also features a first wiring conductor on a first underlying metal layer surface and a second wiring conductor on a second underlying metal layer surface. Notably, the second level difference of the unevenness in the surface region of the second insulating layer is smaller than the first level difference in the first insulating layer. Another patent focuses on a wiring board that includes an insulating layer made of resin containing inorganic insulating particles, with a groove in the surface of the insulating layer that holds a wiring conductor.

Career Highlights

Masaaki Harazono has worked with notable companies such as Kyocera Corporation and Kyocera SLC Technologies Corporation. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the electronics industry.

Collaborations

He has collaborated with talented individuals in his field, including Takayuki Umemoto and Yoshihiro Hosoi. These partnerships have fostered innovation and the development of advanced technologies.

Conclusion

Masaaki Harazono's work in wiring board technology exemplifies his commitment to innovation and excellence. His patents and collaborations continue to influence the electronics industry, showcasing his significant contributions to the field.

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